Encapsulation materials of expoy series for use in electronic components 电子元器件用环氧系灌封材料
Encapsulation materials of phenolic series for use in electronic components 电子元件用酚醛系包封材料
Encapsulation materials of expoy series powder for use in electronic components 电子元器件用环氧系粉末包封材料
Biocompatible encapsulation materials and stimulation interfaces , however , need further refinement before a high - fidelity prosthesis becomes a reality , maybe by 2010 然而,要制造出高真实度的人工视网膜,生物相容性包埋物质以及刺激界面都还需要进一步改良,或许到2010年就能达到这个目标。